Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

{
  "buyer": {
    "id": "GB-FTS-135284",
    "name": "University of Strathclyde"
  },
  "date": "2025-05-20T13:42:07+01:00",
  "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 29279. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\nCommunity benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\nA summary of the expected community benefits has been provided as follows:\nPlease see Procurement documents for full details\n(SC Ref:799129)\nThe buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 29279. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\nCommunity benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\nA summary of the expected community benefits has been provided as follows:\nPlease see Procurement documents for full details\n(SC Ref:799129)",
  "id": "023248-2025",
  "initiationType": "tender",
  "language": "en",
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  "ocid": "ocds-h6vhtk-0518c2",
  "parties": [
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      "address": {
        "countryName": "United Kingdom",
        "locality": "Glasgow",
        "postalCode": "G1 1XU",
        "region": "UKM82",
        "streetAddress": "Learning \u0026 Teaching Building, 49 Richmond Street"
      },
      "contactPoint": {
        "email": "anna.sanina@strath.ac.uk",
        "name": "Anna Sanina",
        "telephone": "+44 7811592949",
        "url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html"
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      "details": {
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        "url": "http://www.strath.ac.uk/"
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      "id": "GB-FTS-135284",
      "identifier": {
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      "name": "University of Strathclyde",
      "roles": [
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      "address": {
        "countryName": "United Kingdom",
        "locality": "Glasgow",
        "postalCode": "G5 9DA",
        "streetAddress": "1 Carlton Place"
      },
      "id": "GB-FTS-2553",
      "identifier": {
        "legalName": "Glasgow Sheriff Court"
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      "name": "Glasgow Sheriff Court",
      "roles": [
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  "tender": {
    "awardPeriod": {
      "startDate": "2025-06-20T12:00:00+01:00"
    },
    "bidOpening": {
      "date": "2025-06-20T12:00:00+01:00"
    },
    "classification": {
      "description": "Semiconductors",
      "id": "31712330",
      "scheme": "CPV"
    },
    "contractTerms": {
      "electronicInvoicingPolicy": "allowed",
      "hasElectronicOrdering": true,
      "hasElectronicPayment": true
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    "coveredBy": [
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    "description": "The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.\nThe line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products.  This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS).  The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres.  As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.\nHigh-efficiency grinder/polisher for wafers\nA Deionised Water Recycling Unit\nAutomatic Cleaning System for wafers",
    "hasRecurrence": false,
    "id": "UOS-35651-2025",
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            "id": "31710000",
            "scheme": "CPV"
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        "contractPeriod": {
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        "description": "The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line.\nThe line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products.  This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS).  The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres.  As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.",
        "hasOptions": true,
        "hasRenewal": false,
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        "options": {
          "description": "The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial\nreplacement of supplies or installations or as extensions of existing supplies and installations.\nThe Contracting Authority may at it\u0027s sole discretion exercise this option."
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    "mainProcurementCategory": "goods",
    "procurementMethod": "open",
    "procurementMethodDetails": "Open procedure",
    "reviewDetails": "Precise information on deadline(s) for review procedures:\nAn economic operator that suffers, or risks suffering, loss or damage attributable to a breach of duty under the Public Contracts (Scotland) Regulations\n2015(SSI2015/446) (as amended) may bring proceedings in the Sheriff Court or the Court of Session.",
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          "description": "4B 1.2 Turnover\nBidders will be required to have an average yearly turnover of a minimum of 4,000,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.",
          "minimum": "4B.5.1- 4B5.3 Insurances\nInsurance requirements are in line with levels identified in the UOS standard Terms and Conditions.\nIt is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below:\nThe Contractor shall maintain in force with reputable insurers\nEmployer\u2019s (Compulsory) Liability Insurance = GBP 10m\nPublic and Product Liability Insurance = GBP 10m\nProfessional Risk Indemnity Insurance = GBP 2m\nIn respect of any one incident and unlimited as to numbers of claims",
          "type": "economic"
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          "description": "4C.1.2 Previous Experience\nBidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice.",
          "type": "technical"
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    "status": "active",
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    "submissionTerms": {
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        "durationInDays": 120
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      "languages": [
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      ]
    },
    "tenderPeriod": {
      "endDate": "2025-06-20T12:00:00+01:00"
    },
    "title": "Supply, Delivery, Installation \u0026 Commissioning of a Wafer Thinning Turnkey ITT",
    "value": {
      "amount": 2000000,
      "currency": "GBP"
    }
  }
}