Buyer Name: University of Strathclyde
Buyer Address: Learning & Teaching Building, 49 Richmond Street, Glasgow, UKM82, G1 1XU
Contact Name: Anna Sanina
Contact Email: anna.sanina@strath.ac.uk
Contact Telephone: +44 7811592949
Buyer Name: University of Strathclyde
Buyer Address: Learning & Teaching Building, 49 Richmond Street, Glasgow, UKM82, G1 1XU
Contact Name: Anna Sanina
Contact Email: anna.sanina@strath.ac.uk
Contact Telephone: +44 7811592949
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
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External Link: https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904
Link Title: Supply, Delivery and Installation of Sinter Bonding Capability
Link Description: National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
Lot Description: NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R&D activities and medium volume production. In the R&D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum. In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker. In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.
Lot 1 Status: active
Lot 1 Has Options: Yes
Lot 1 Options: The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option.
Lot 1 Award Criterion (quality): Quality
Document Title: Supply, Delivery and Installation of Sinter Bonding Capability
Document Description: National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
{
"buyer": {
"id": "org-41",
"name": "University of Strathclyde"
},
"date": "2025-12-17T00:00:00Z",
"description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 30834. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\r\n Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\r\n A summary of the expected community benefits has been provided as follows:\r\n Please see Procurement documents for full details\r\n (SC Ref:818603)\r\n The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 30834. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\r\n Community benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\r\n A summary of the expected community benefits has been provided as follows:\r\n Please see Procurement documents for full details\r\n (SC Ref:818603)",
"id": "rls-21-DEC545904",
"initiationType": "tender",
"language": "EN",
"links": [
{
"href": "https://api.publiccontractsscotland.gov.uk/v1/Notice?id=ocds-r6ebe6-0000818603",
"rel": "canonical"
}
],
"ocid": "ocds-r6ebe6-0000818603",
"parties": [
{
"address": {
"locality": "Glasgow",
"postalCode": "G1 1XU",
"region": "UKM82",
"streetAddress": "Learning \u0026 Teaching Building, 49 Richmond Street"
},
"contactPoint": {
"email": "anna.sanina@strath.ac.uk",
"name": "Anna Sanina",
"telephone": "+44 7811592949",
"url": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html"
},
"details": {
"classifications": [
{
"id": "Body governed by public law",
"scheme": "TED_CA_TYPE"
},
{
"description": "Education",
"id": "09",
"scheme": "COFOG"
}
],
"url": "http://www.strath.ac.uk/"
},
"id": "org-41",
"identifier": {
"legalName": "University of Strathclyde"
},
"name": "University of Strathclyde",
"roles": [
"buyer",
"centralPurchasingBody"
]
},
{
"address": {
"locality": "Glasgow"
},
"contactPoint": {
"url": "http://"
},
"id": "org-4",
"identifier": {
"legalName": "Glasgow Sheriff Court"
},
"name": "Glasgow Sheriff Court",
"roles": [
"reviewBody"
]
}
],
"tag": [
"tender"
],
"tender": {
"awardPeriod": {
"startDate": "2026-01-26T12:00:00Z"
},
"bidOpening": {
"date": "2026-01-26T12:00:00Z"
},
"classification": {
"id": "38000000",
"scheme": "CPV"
},
"contractTerms": {
"electronicInvoicingPolicy": "allowed",
"hasElectronicOrdering": true,
"hasElectronicPayment": true
},
"coveredBy": [
"GPA"
],
"description": "National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.",
"documents": [
{
"description": "National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.",
"documentType": "contractNotice",
"format": "text/html",
"id": "DEC545904",
"title": "Supply, Delivery and Installation of Sinter Bonding Capability",
"url": "https://www.publiccontractsscotland.gov.uk/search/show/search_view.aspx?ID=DEC545904"
}
],
"hasRecurrence": false,
"id": "UOS-39043-2025",
"items": [
{
"deliveryAddresses": [
{
"region": "UKM82"
}
],
"id": "1",
"relatedLot": "1"
}
],
"legalBasis": {
"id": "32014L0024",
"scheme": "CELEX"
},
"lots": [
{
"awardCriteria": {
"criteria": [
{
"description": "50",
"name": "Quality",
"type": "quality"
},
{
"description": "50",
"type": "price"
}
]
},
"contractPeriod": {
"durationInDays": 720
},
"description": "NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements.\r\n The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells.\r\n The focus of this procurement activity is to acquire a sinter bonding press that is versatile to support both R\u0026D activities and medium volume production.\r\n In the R\u0026D context we require a capability that allows flexible exploration of tooling to achieve different package arrangements, while keeping tool costs at a minimum.\r\n In the medium scale production context we require a capability that includes automated handling solutions such that it can be fed by a magazine unstacker, and can feed a magazine stacker.\r\n In either context we require the ability to form bonds under inert atmosphere or forming gas, control the pre-heating and post-cooling ramp profile of sinter bonded assemblies and collect detailed sensor-driven time-histories of temperature and pressure for each bonding operation.",
"hasOptions": true,
"hasRenewal": true,
"id": "1",
"options": {
"description": "The Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it\u0027s sole discretion exercise this option."
},
"renewal": {
"description": "12 months (if required maintenance and warranty)"
},
"status": "active",
"submissionTerms": {
"variantPolicy": "notAllowed"
}
}
],
"mainProcurementCategory": "goods",
"procurementMethod": "open",
"procurementMethodDetails": "Open procedure",
"selectionCriteria": {
"criteria": [
{
"description": "4B 1.2 Turnover\r\n Bidders will be required to have an average yearly turnover of a minimum of GBP1,800,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that may impact the supplier or supply chain.",
"minimum": "4B.5.1- 4B5.3 Insurances\r\n Insurance requirements are in line with levels identified in the UOS standard Terms and Conditions.\r\n It is a requirement of this contract that bidders can hold or commit to obtain prior to the commencement of any subsequently awarded contract, the types of insurance indicated below:\r\n The Contractor shall maintain in force with reputable insurers\r\n Employer\u00e2\u0080\u0099s (Compulsory) Liability Insurance = GBP10m\r\n Public and Product Liability Insurance = GBP10m\r\n Professional Risk Indemnity Insurance = GBP2m\r\n In respect of any one incident and unlimited as to numbers of claims",
"type": "economic"
},
{
"description": "4C.1.2 Previous Experience\r\n Bidders will be required to provide three (3) examples that demonstrate that they have the relevant experience to deliver the equipment as stated in the Contract Notice.",
"type": "technical"
}
]
},
"status": "active",
"submissionMethod": [
"electronicSubmission"
],
"submissionMethodDetails": "https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html",
"submissionTerms": {
"bidValidityPeriod": {
"durationInDays": 120
},
"languages": [
"en"
]
},
"tenderPeriod": {
"endDate": "2026-01-26T12:00:00Z"
},
"title": "Supply, Delivery and Installation of Sinter Bonding Capability",
"value": {
"amount": 900000.0,
"currency": "GBP"
}
}
}